Yibo Fan received the B.E. degree in electronics and engineering from Zhejiang University, China in 2003, M.S. degree in microelectronics from Fudan University, China in 2006, and Ph.D. degree in engineering from Waseda University, Japan in 2009. From 2009 to 2010, he worked as an assistant professor in Shanghai Jiaotong University, and currently, he is the associate professor in the State Key Lab of ASIC and System, college of microelectronics of Fudan University. His research interesting includes video coding, image processing, virtual reality, deep learning and associated VLSI architecture.
Come from Shijiazhuang, Hebei, received the B.E. degree in Microeletronics from Xidian University, China in 2015.
Come from Hangzhou, received B.E. degree in Microelectronics from Fudan University, China in 2016.
Come from Hubei, received the B.E. degree in microelectronics from Fudan University, China in 2016.
Come from Harbin, received the B.E degree in Microelectronics from Fudan University, China in 2016.
Come from Puyang, Henan, received B.E. degree in Microelectronics from Fudan University, China in 2016.
Come from Shaanxi,received the B.E. degree in microelectronics from Xidian University,China in 2013.
Come from Chongqing,received the B.E. degree in Microelectronics Engineering from Fudan University, China in 2017.
Come from Shaoxing Zhejiang, received the B.E. degree in Microelectronics Engineering from Fudan University, China in 2017.
Come from Taizhou,Jiangsu,received the B.E. degree in Microelectronics Engineering from Fudan University, China in 2017.
Come from Anhui,received the B.E. degree in Integrated circuit design and system integration from Huazhong University of Science and Technology,China in 2017.
Come from Anhui, received the B.E. degree in Microelectronics Science and Engineering from Wuhan University, China in 2017.
Come from Guilin,Guangxi,received the B.E. degree in Microelectronics Engineering from Fudan University, China in 2017.
Come from Zhejiang Province, received the B.E. degree in Microelectronic from Fudan University, China in 2017.
Come from xiangyang, received B.E. degree in Microelectronics from Fudan University, China in 2017..
Come from Hunan, Currently completing final year of a B.E.degree of Microelectronics in Fudan University.
Come from Fujian Province, received the B.E. degree in ME from Fudan University, China in 2017.
Received the M.S. degree in 2017.
Received the M.E. degree in 2017.
Received the M.S. degree in 2017.
Received the M.S. degree in 2017.
Received the M.E. degree in 2017.
Received the M.E. degree in 2017.